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https://doi.org/10.1109/TPEL.2025.3630790

2. Kovács, K., Minárok, M., Kozárik, J., & Marek, J. (2026). A Weibull-Based Statistical Lifetime Assessment of SiC MOSFETs Under Multivariable Short-Circuit Stress. In: Proceedings of the International Seminar on Power Semiconductors (ISPS). ISBN 978-80-554-2303-6.

3. Horn, T., Albrecht, J., Mathew, A., Eichhorn, R., & Rzepka, S. (2025). Toward lifetime prediction under variable load conditions in power electronics: Evaluation of damage accumulation rules for solder system attach. In 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC). IEEE.

4. Kovács, K., Minárik, M., Kozárik, J., Marek, J., (2026). Statistical Analysis of Short-Circuit Endurance in SiC MOSFETs under Voltage and Temperature Variations. In 49th Workshop on Compound Semiconductor Devices and Integrated Circuits (WOCSDICE) and 20th Expert Evaluation and Control of Compound Semiconductor Materials and Technologies (EXMATEC), Gdańsk, Poland. Institute of High Pressure Physics, Polish Academy of Sciences.



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