General Assembly Meeting M6

Events 2026/02/25

The 2nd General Assembly for HiPower 5.0 took place in Munich from 21-22 January 2026, hosted by our project partner Infineon. Most of the two-day meeting was dedicated to Use Cases. HiPower 5.0 is progressing as it should be, and even faster than expectations in some cases. The event was very convenient, and the event's participants enjoyed a social dinner at a nice, traditional Bavarian venue, perfectly organized by the hosting partner, Infineon AG. Read more on LinkedIn!

Resource-efficient eDrive technology with WBG semiconductors for sustainable mobility

Facts
Name: HiPower 5.0
Duration: July 2025 – June 2028
Budget: ~ EUR 58 Mio.
Consortium: 45 partners from 11 countries

Coordination
Christoph Abart
Annemarie Hamedler
AVL List GmbH
Hans-List-Platz 1
A-8020 Graz

The HiPower 5.0 Project (Grant Agreement No. 101194250) is supported by the Chips Joint Undertaking and its members, including the top-up funding by Austria, Belgium, the Czech Republic, Denmark, France, Germany, Italy, the Netherlands, Slovakia, and Slovenia. Co-funded by the European Union. Views and opinions expressed are, however, those of the author(s) only and do not necessarily reflect those of the European Union, Chips JU, or the national granting authorities. Neither the European Union nor the granting authorities can be held responsible for them.

General Assembly Meeting M6

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