Kick-off for HiPower 5.0: Next-Gen Semiconductors for sustainable e-mobility
Events 2025/07/08Building on HiEFFICIENT, this project represents a next step forward in technological advancement. During these two days, the Work Packages were introduced, and alignment withing the Use Cases took place. Stay tuned and follow us on LinkedIn!
Facts
Name: HiPower 5.0
Duration: July 2025 – June 2028
Budget: ~ EUR 58 Mio.
Consortium: 45 partners from 11 countries
Coordination
Christoph Abart
Annemarie Hamedler
AVL List GmbH
Hans-List-Platz 1
A-8020 Graz
The HiPower 5.0 Project (Grant Agreement No. 101194250) is supported by the Chips Joint Undertaking and its members, including the top-up funding by Austria, Belgium, the Czech Republic, Denmark, France, Germany, Italy, the Netherlands, Slovakia, and Slovenia. Co-funded by the European Union. Views and opinions expressed are, however, those of the author(s) only and do not necessarily reflect those of the European Union, Chips JU, or the national granting authorities. Neither the European Union nor the granting authorities can be held responsible for them.